一种超厚铜印制电路板

Super thick copper printed circuit board

Abstract

The utility model relates to a super thick copper printed circuit board, including super thick copper base plate, silica gel cover, thermal adhesive layer, polytetrafluoroethylene circuit board, solder resist ink layer, aluminum nitride protective layer and blind hole. This super thick copper printed circuit board, through super thick copper base plate as the backup pad, this super thick copper printed circuit board's of improvement that can be very big heat conductivility, use the polytetrafluoroethylene circuit board, paint the solder resist ink layer on the surface of polytetrafluoroethylene circuit board, and at the top on solder resist ink layer installation aluminum nitride protective layer, to the solder resist ink layer protecting, avoid in the welding process of large -scale original paper scraping the solder resist ink layer and damage the polytetrafluoroethylene circuit board after spending, and at the top of super thick copper base plate installation silica gel cover, through the edge of silica gel cover to the polytetrafluoroethylene circuit board, the edge on solder resist ink layer and the edge of aluminum nitride protective layer protect, be convenient for carry on heat transfer work simultaneously.
本实用新型涉及一种超厚铜印制电路板,包括超厚铜基板、硅胶套、导热胶层、聚四氟乙烯线路板、阻焊油墨层、氮化铝保护层和盲孔。该超厚铜印制电路板,通过超厚铜基板作为支撑板,可极大的提高该超厚铜印制电路板的导热性能,使用聚四氟乙烯线路板,在聚四氟乙烯线路板的表面涂抹阻焊油墨层,并在阻焊油墨层的顶部安装氮化铝保护层,对阻焊油墨层进行保护,避免在大型原件的焊接过程中将阻焊油墨层刮花后损坏到聚四氟乙烯线路板,并且在超厚铜基板的顶部安装硅胶套,通过硅胶套对聚四氟乙烯线路板的边缘、阻焊油墨层的边缘以及氮化铝保护层的边缘进行防护,同时便于进行热传递工作。

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